Application Instructions:
According to the manufacturer: "Due to the high amount of diamond powder (94%) in IC Diamond Compound, the material is very thick. The plunger on the syringe should not be forced which would result in its breaking.
Squeeze slowly using constant, even pressue - it will take about 3-4 seconds to squeeze out the proper amount.
Warming the Thermal compound syringe in a cup of hot water for several minutes will enhance application.
Clean the CPU to ensure that it is clean of any grease or particulate matter.
Squeeze a pea-sized amount of IC Diamond in the center of the CPU and apply the heatsink. Once the heatsink is mounted, the compound will spread out and cover the entire CPU and settle into a uniform thickness in about 2 hours.
Savings Note: Covering the entire CPU is a waste of compound as any excess is squeezed out - the final bond line is only .001 or .002 inches thick. Single line and other application methods do not provide uniform coverage and will require re-application for the best results."